Cadence and Intel Foundry Expand Collaboration to Accelerate Intel 14A Development

Cadence and Intel Foundry have announced an expanded multi-year collaboration aimed at accelerating the development and optimization of Intel’s next-generation 14A process technology, targeting future high-performance computing (HPC) and mobile designs.

The partnership combines Cadence’s AI-driven electronic design automation (EDA) technologies and Design IP portfolio with Intel Foundry’s process and advanced design expertise to improve chip development efficiency and performance.

Driving Better Performance Through DTCO

At the center of the collaboration is Design Technology Co-Optimization (DTCO) — an approach that aligns process technology, design tools, and workflows to maximize performance, power efficiency, and silicon area (PPA).

Cadence and Intel will work together to optimize design methodologies and deliver production-ready Process Design Kits (PDKs) for Intel 14A. The initiative will also integrate Cadence’s agentic AI design flows to help customers reduce design complexity, lower development risk, and shorten time-to-market.

Supporting the Next Generation of Chip Innovation

Cadence President and CEO Anirudh Devgan described the expanded relationship as a major milestone that combines the strengths of both companies to unlock higher levels of performance, power efficiency, and innovation.

Meanwhile, Naga Chandrasekaran said the collaboration reinforces Intel Foundry’s commitment to delivering its technology roadmap and ecosystem for customers worldwide.

By combining advanced manufacturing, packaging technologies, and AI-powered design capabilities, both companies aim to accelerate the development of next-generation semiconductor products at scale.