Cadence Introduces AuraStack AI Super Agent for Faster PCB and Advanced Packaging Design
Cadence has unveiled the AuraStack™ AI Super Agent, the world’s first agentic AI platform for PCB and advanced packaging design, designed to accelerate the development of next-generation electronic systems.
Running on Cadence Allegro AI Studio and powered by NVIDIA Blackwell and NVIDIA CUDA-X, the AuraStack AI Super Agent combines AI-driven automation with Cadence’s electronic design tools to help engineers move from system planning to final product development in a single intelligent environment.
Cadence says the platform can deliver up to 2X faster time-to-market, 15X higher productivity, and improved design quality through advanced multiphysics optimisation.
The AuraStack AI Super Agent integrates AI agents across planning, implementation, routing, manufacturability, and multiphysics analysis. It enables engineers to optimise electrical, thermal, and mechanical performance earlier in the design process, helping reduce costly redesigns and improve system reliability.
The platform builds on Cadence’s broader AI ecosystem, including ChipStack™, InnoStack™, and ViraStack™ AI Super Agents, extending AI capabilities from silicon design to complete electronic systems.
Cadence is also collaborating with industry leaders including NVIDIA and TSMC to advance AI-powered engineering workflows for complex semiconductor packaging and high-performance computing applications.
With electronic systems becoming increasingly complex, Cadence’s AuraStack AI Super Agent aims to help engineers design faster, improve efficiency, and accelerate innovation across industries such as AI infrastructure, automotive, aerospace, and advanced computing.
The Cadence AuraStack AI Super Agent will be available in 2026.
