Samsung Electronics and AMD have signed a new agreement to deepen their collaboration on next-generation AI memory and computing solutions, focusing on high-performance data center technologies.
The partnership will see Samsung supply its latest HBM4 memory for upcoming AMD AI accelerators, including the Instinct MI455X GPU. This next-gen memory is designed to deliver faster speeds, higher bandwidth, and improved energy efficiency—key factors for powering large-scale AI workloads like model training and inference.
Samsung’s HBM4 is built on an advanced DRAM process and offers speeds of up to 13Gbps with bandwidth reaching 3.3TB/s, positioning it as a major upgrade for future AI infrastructure. Combined with AMD’s GPU and CPU platforms, the solution aims to deliver more efficient and scalable performance across data centers.
Beyond GPUs, both companies will also collaborate on optimized DDR5 memory for upcoming AMD EPYC processors, supporting next-generation systems and rack-scale platforms like AMD Helios.
This move strengthens a long-standing partnership between Samsung and AMD, with both companies working closely to accelerate AI innovation through tighter integration across hardware—from memory and processors to full system architecture.