• Leading 20+1+2 phases digital power VRM design, providing exceptional performance with a cool and user-friendly experience.

GIGABYTE TECHNOLOGY Co. Ltd. unveiled the Z790 AORUS gaming motherboards, which are specially made for the newest 13th Gen Intel® Core™ processor. GIGABYTE’s Z790 AORUS lineup is equipped with the best power design and thermal management to unleash the extreme performance and optimised overclocking experience on the new generation multi-core K series Intel® Core™ processors. It features up to 20+1+2 phases digital power VRM design with each phase holding up to 105 amps Fins-Array III heatsink design.

The BIOS option for DDR5 memory overclocking and the distinctive SMD memory slots with metal shielding mask for anti-interference provide more reliable signals to memory, allowing users to easily increase XMP and overclocking performance. The GIGABYTE Z790 AORUS motherboards are designed for PCIe® 5.0 graphics cards and SSDs. The Improved SMD slots increase signal stability and longevity, and PCIe® and M.2 EZ-Latch technology is used to simplify access and prevent unintentional damage to neighboring components while also making it simpler for customers to update graphics cards and M.2 SSDs.

“With the advent of the new generation Intel® Z790 platform and the 13th generation Core™ processor, GIGABYTE also launched the latest motherboards to provide users ultra durable products with premium compatibility, breakthrough performance, and low temperature through optimized power supply, heat dissipation and expansions. Featuring premium components and exclusive tuning function, GIGABYTE Z790 motherboards boost the overall and overclocking performance of CPU and memories.” said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “Featuring enhanced SMD PCIe® 5.0 x16 and M.2 slots with EZ-Latch design, lightning-fast networking of 2.5G or above, and Wi-Fi 6E dedicated spectrum, GIGABYTE Z790 motherboards impress users by its remarkable performance and stability to become the perfect choice for Intel® Z790 platform.”

The 13th gen Intel® Core™ processors carry on the Intel® 7 stepping and “hybrid” architecture of P-Core and E-Core, which increases the amount of E-Core and also enables the processors to dynamically switch between high-performance operation and low loading energy saving mode.  This enables users to utilise processors to their greatest potential based on the requirements of system operation.

The flagship GIGABYTE Z790 AORUS enhance the extreme overclocking performance on all-core multi cores, delivering more than 2200 Amps to provide the best power balance. It has up to 20+1+2 phases with each Vcore and Vcc GT holding up to 105 amps by its Smart Power Stage design. To avoid CPU throttling due to overheating, it offers more consistent power and dissipates heat from high loading operation or overclocking more effectively.

Moreover, Tantalum Polymer enhances the VRM’s transient response to high and low loads while also boosting the purity and stability of power for processors, supplying a plentiful and reliable power foundation so customers won’t have to worry about overlocking.

GIGABYTE prepares multiple Z790 motherboards for users based on market need and positioning variances. DDR5 models benefit from a new memory architecture that allows for excellent power efficiency, low latency, and low power consumption, while DDR4 units function admirably. Aside from the well-known Shielded Memory Routing of SMD memory DIMMs and dual metal armour, GIGABYTE Z790 motherboards feature a new generation low-impedance PCB and layouts, allowing customers to experience superior memory overclocking performance with increased durability and stability. Real-world testing confirm an overclocked performance gain of up to DDR5-7600.

GIGABYTE Z790 AORUS motherboards have various noticeable advancements from the Z690 platform to readily give customers a remarkable DDR5 memory overclocking performance. The “DDR5 Unlocked Voltage” function, which has been strengthened by a new, proprietary layout design, can unlock the adjustment range of DDR5 memory native voltage, enabling users to attain higher memory clocks with greater reliability. Under BIOS settings, “DDR5 XMP Booster” automatically determines the controller brand, enabling users to rapidly select from a variety of built-in and pre-tuned memory overclocking programmes to accelerate native DDR5 or XMP DDR5 memories. To unleash the ultimate performance of memory, “XMP 3.0 User Profile” gives users the ability to independently design and burn in XMP profiles.

GIGABYTE Z790 AORUS MASTER and above motherboards use new generation Fins-Array III technology, which further increases the thermal fin’s surface area to 9 times that of a conventional heatsink, allowing for more cool air to pass through for enhanced heat dissipation. With a shorter distance and a larger surface area of contact between the heatpipe and the heatsink for more effective heat transmission, the Direct-Touch Heatpipe II design lowers temperatures more quickly.

Some GIGABYTE Z790 AORUS motherboards have a new generation LAIRD 12W/mK thermal pad in the VRM region, which provides much better heat dissipation than standard thermal pads. Furthermore, some AORUS motherboards include a metal back plate with nano-carbon coating for an attractive thermal design, while many Z790 AORUS models retain the previous designs’ full-coverage one-piece metal plate on the MOS region for more effective heat dissipation. The many skived fins and grooved surface give double the dissipation area of standard designs, significantly improving heat convection and conduction by enabling more airflow to pass through the heatsink.

GIGABYTE Z790 motherboards use an 8-layer and above 2OZ-copper PCB for improved heat dissipation during high-speed CPU operation to minimise performance throttling caused by overheating. In addition to the hardware thermal design on VRM, GIGABYTE Z790 motherboards integrate Smart Fan 6 technology and the EZ Tuning feature to provide customers with an ideal combination of silent, cool, and high performance.

The larger heatsink and enhanced M.2 thermal guard of select Z790 AORUS motherboards, particularly the Thermal Guard XTREME II on the flagship Z790 AORUS XTREME with Direct-Touch Heatpipe II and specially designed 8cm-high thermal fin, provide optimal cooling for PCIe® 5.0 M.2 SSDs to prevent thermal throttling during high-speed operation.

GIGABYTE Z790 AORUS motherboards use PCIe® 5.0 design and select components for PCBs, PCIe® slots, M.2 slots, and even controllers to deliver optimum signal quality and prepare for future technologies in order to fulfill the high-speed bandwidth requirements of the next generation of graphics cards. Meanwhile, the Z790 AORUS supports PCIe® and M.2 EZ-Latch technology, as well as improved EZ-Latch PLUS for rapid graphics card and M.2 SSD detachment. As next-generation graphics cards become bigger, accessing the typical PCIe® release latch can be difficult.

PCIe® EZ-Latch and EZ-Latch Plus technology has a larger latch and conveniently accessible button, making it easier to remove installed cards and lowering the danger of accidentally injuring the board. Furthermore, GIGABYTE’s exclusive next-generation SMD PCIe®x16 slots are developed with increased armour that provides reinforced tensile strength and a robust design, increasing shear resistance by up to 2.2 times on the SMD M.2 design and 1.5 times on the SMD PCIe®x16 design.

The existing M.2 SSD screws are replaced with auto or manual locking latches in the M.2 EZ-Latch and EZ-Latch Plus designs, which reduces the problems of screw alignment or loss and substantially simplifies M.2 SSD installation.

The Z790 AORUS series includes 2.5Gb Ethernet as the new standard, with 10Gbit on flagship models, as well as a WiFi 6E 802.11ax network for the most comprehensive and versatile network choices. Meanwhile, DCT (Double Connect Technology) allows network traffic packets to be dynamically changed to minimise online gaming latency, while also optimising streaming and immersive VR experiences and sparing users from network cable issues. DCT supports various frequency bands on the Wi-Fi 6E network, which can connect across two Wi-Fi devices at the same time.

GIGABYTE Z790 AORUS motherboards also have the most up-to-date connectivity technologies, such as USB 3.2 Gen2x2, 3.2 Gen2 ports, and Thunderbolt™ 4 / USB 4 extensions, to address ever-increasing connectivity needs. The series incorporates a high SNR audio engine and WIMA FKP2 studio-grade audio capacitors, as well as a professional ESS SABRE DAC with GIGABYTE proprietary design and DTS:X® Ultra to produce high quality audio for the most abundant sound experience, whether gaming or entertaining.

Furthermore, GIGABYTE replaces the conventional APP Center application with new, simplified software named GCC (GIGABYTE Control Center). With its brand-new user interface (UI), GCC’s management platform categorises user’s GIGABYTE apps and will automatically identify installed GIGABYTE hardware for simple driver installation. Users can now install, upgrade, and administer a variety of programmes with ease and take use of all the benefits of GIGABYTE equipment. The launch of GIGABYTE Z790 motherboards will allow consumers to take use of all the great features of AORUS and further establish GIGABYTE motherboards as the best option for high-end and gaming motherboards.
Please visit the AORUS website at https://www.aorus.com for more information.

For more information and news on GIGABYTE products, please visit the official GIGABYTE website: http://www.gigabyte.com

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