September 15, 2026

OPPO Find X10 Pro Max to Debut Globally with MediaTek Dimensity 9600 Pro

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OPPO has confirmed that its upcoming Find X10 Pro Max will be among the first smartphones to feature MediaTek’s new flagship Dimensity 9600 Pro chipset, with the device set to launch in international markets.

Built using TSMC’s advanced 2nm N2P process, the Dimensity 9600 Pro is designed to deliver higher performance while improving power efficiency. MediaTek claims up to a 61% improvement in CPU multi-core energy efficiency compared with the previous-generation process, which should benefit sustained performance and on-device AI workloads.

The chipset continues MediaTek’s All-Big-Core architecture, featuring two C2-Ultra cores clocked at up to 4.55GHz, alongside six performance cores. CPU performance is said to improve by up to 17%, while independent core frequency control allows the system to better manage workloads and power consumption.

Graphics performance is handled by the new G2-Ultra NX GPU, which adds enhanced ray tracing and neural graphics capabilities. Under sustained heavy workloads, MediaTek claims around 27% higher performance, potentially delivering smoother gaming and more detailed visuals.

AI performance also gets a major boost through a new dual-NPU design. The high-performance NPU offers up to 51% faster LLM prefill performance for tasks such as large-language-model processing and computational photography, while the Super-Efficient NPU is designed to deliver 40% better power efficiency for low-power, always-on AI features.

The Find X10 Pro Max will also introduce OPPO and MediaTek’s new Laminar Flow Engine, which optimises rendering and system scheduling to balance responsiveness with power efficiency. OPPO says the technology can help improve app launch speeds and maintain smoother performance when handling demanding tasks such as quickly browsing large numbers of photos.

OPPO is expected to reveal more details about the Find X10 Pro Max, including its full specifications and availability, during its upcoming global launch event.