Vertiv has expanded its thermal management portfolio with the introduction of the Vertiv™ CoolLoop Trim Cooler, a next-generation heat rejection system designed for hybrid liquid and air cooling in AI and high-performance computing (HPC) environments.
This energy-efficient and space-saving solution is built to handle fluctuating water temperatures, a common challenge in AI and HPC applications. It delivers up to 70% energy savings by leveraging free-cooling and mechanical operation while reducing space usage by 40% compared to traditional systems. Designed for AI factories and high-density data centers, the system efficiently supports supply water temperatures up to 40°C and cold plate functionality at 45°C.
Seamless Integration for High-Density Cooling
The Vertiv CoolLoop Trim Cooler offers straightforward water connections, ensuring smooth integration with:
- Vertiv™ CoolChip CDU coolant distribution units for direct-to-chip cooling
- Immersion cooling systems for simplified installation and enhanced efficiency
This plug-and-play design minimizes operational complexity, providing cost and time savings for data centers adapting to AI-driven workloads.
Optimized for Asia’s AI Growth
“As AI adoption accelerates, Asia needs scalable, energy-efficient cooling solutions that can handle high heat densities,” said Cheehoe Ling, Vice President, Product Management Asia at Vertiv. “The Vertiv™ CoolLoop Trim Cooler delivers industry-leading efficiency while adapting to diverse climate conditions.”
Future-Proofed for Sustainability and Compliance
The Vertiv CoolLoop Trim Cooler is designed with sustainability in mind:
- Uses low-GWP refrigerant to minimize environmental impact
- Scalable cooling capacity of up to 3 MW in air-cooled mode
- Optimized for high ambient temperatures, reducing electrical consumption and CO₂e emissions
- Compliant with the 2027 EU F-GAS regulations, eliminating the need for costly infrastructure upgrades
For more information on Vertiv’s AI cooling solutions, visit Vertiv.com.