Essencore and KLEVV Showcase Next-Generation Memory and Storage Innovations at COMPUTEX 2026

Essencore and its consumer memory brand KLEVV are set to unveil their latest memory and storage technologies at COMPUTEX Taipei 2026 under the theme “From Cycles to Skywards, Memory Shapes the Future.” The showcase highlights the growing importance of memory and storage solutions in supporting AI computing, high-performance systems, and data-intensive applications.

Visitors can explore the latest innovations at Taipei Nangang Exhibition Center Hall 1, 4th Floor, Booth N0114, from June 2–5.

A major highlight will be KLEVV’s new lineup of DDR5 overclocking memory kits, available in both RGB and non-RGB variants. Designed for gamers, creators, and AI-powered workloads, the upcoming modules offer improved speed, efficiency, and reliability, with a preview ahead of their official launch.

KLEVV will also expand its storage portfolio with new PCIe Gen5 and Gen4 M.2 SSDs, delivering faster data processing and responsiveness for demanding applications such as AI workloads, real-time rendering, and large-scale data transfers. A newly designed portable SSD will also make its debut, providing fast and convenient storage for professionals and content creators.

For enterprise and professional computing, Essencore will showcase advanced memory solutions including DDR5 RDIMM modules for servers and workstations, DDR5 CQDIMM with 4-rank architecture for enhanced bandwidth, LPDDR5T-based SOCAMM2 modules for compact high-performance systems, and DDR5 CKD U-DIMM memory designed for modern desktop platforms.

Throughout the exhibition, visitors will be able to experience live demonstrations showcasing the real-world performance of Essencore and KLEVV’s latest memory and storage technologies across AI, high-performance computing, and data-centric applications.

Essencore & KLEVV at COMPUTEX 2026

Venue: Taipei Nangang Exhibition Center, Hall 1, 4F
Booth: N0114
Dates: June 2–5, 2026