Cadence Tensilica IP Powers ADI’s Next-Generation Automotive DSP
Cadence and Analog Devices (ADI) have collaborated on the next generation of ADI's SHARC automotive audio processors, integrating Cadence's Tensilica...
Cadence
Cadence PCIe 6.0 Subsystem Achieves First-Pass Compliance on TSMC N3
Cadence has announced that its PCI Express (PCIe) 6.0 PHY and controller IP, implemented on TSMC’s N3 process, has successfully...
Cadence Introduces AuraStack AI Super Agent for Faster PCB and Advanced Packaging Design
Cadence has unveiled the AuraStack™ AI Super Agent, the world’s first agentic AI platform for PCB and advanced packaging design,...
Rapidus and Cadence Partner to Accelerate AI-Driven SoC Design
Rapidus Corporation and Cadence have announced a strategic collaboration to advance AI-powered semiconductor development by integrating the Cadence InnoStack AI...
Cadence and Intel Foundry Expand Collaboration to Accelerate Intel 14A Development
Cadence and Intel Foundry have announced an expanded multi-year collaboration aimed at accelerating the development and optimization of Intel’s next-generation...
Cadence Introduces Industry’s First Fully Autonomous Virtual Engineer for Chip Design Powered by NVIDIA
At COMPUTEX 2026, Cadence announced a major advancement in semiconductor development with the introduction of the industry’s first fully autonomous...
Cadence and Samsung Foundry Expand 2nm and 3D-IC Partnership to Power the Next Wave of AI Computing
Cadence and Samsung Foundry have announced a significant expansion of their strategic collaboration, strengthening support for next-generation AI infrastructure, high-performance...
